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Thermal Management Materials for Electronic Packaging

By X Tian
About Thermal Management Materials for Electronic Packaging

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

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  • Language:
  • English
  • ISBN:
  • 9783527352425
  • Binding:
  • Hardback
  • Pages:
  • 368
  • Published:
  • January 16, 2024
  • Dimensions:
  • 251x175x24 mm.
  • Weight:
  • 834 g.
  In stock
Delivery: 3-5 business days
Expected delivery: April 16, 2025

Description of Thermal Management Materials for Electronic Packaging

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

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