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Thermo-mechanische und mikrostrukturelle Charakterisierung von Kupfer-Durchkontaktierungen im Silizium (Through Silicon Vias)
- Binding:
- Paperback
- Pages:
- 154
- Published:
- July 19, 2016
- Dimensions:
- 210x148x9 mm.
- Weight:
- 209 g.
Delivery:
1-2 weeks
Expected delivery: December 7, 2024
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