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Through Silicon Vias

- Materials, Models, Design, and Performance

About Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

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  • Language:
  • English
  • ISBN:
  • 9780367574543
  • Binding:
  • Paperback
  • Pages:
  • 216
  • Published:
  • June 29, 2020
  • Dimensions:
  • 156x234x0 mm.
  • Weight:
  • 430 g.
Delivery: 1-2 weeks
Expected delivery: December 12, 2024
Extended return policy to January 30, 2025

Description of Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

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