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Through Silicon Vias

- Materials, Models, Design, and Performance

About Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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  • Language:
  • English
  • ISBN:
  • 9781498745529
  • Binding:
  • Hardback
  • Pages:
  • 216
  • Published:
  • August 25, 2016
  • Dimensions:
  • 253x165x18 mm.
  • Weight:
  • 498 g.
Delivery: 2-4 weeks
Expected delivery: December 20, 2024
Extended return policy to January 30, 2025

Description of Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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