Join thousands of book lovers
Sign up to our newsletter and receive discounts and inspiration for your next reading experience.
By signing up, you agree to our Privacy Policy.You can, at any time, unsubscribe from our newsletters.
Transient Study on Heat Dissipation Problem in Microelectronics
- Binding:
- Paperback
- Pages:
- 52
- Published:
- May 22, 2020
- Dimensions:
- 229x152x3 mm.
- Weight:
- 91 g.
Delivery:
1-2 weeks
Expected delivery: July 17, 2025
User ratings of Transient Study on Heat Dissipation Problem in Microelectronics
Rate this book
In order to rate this book you must be logged in.Others also bought..
Find similar books
The book Transient Study on Heat Dissipation Problem in Microelectronics can be found in the following categories: