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Wafer-Level Chip-Scale Packaging
- Analog and Power Semiconductor Applications
- Binding:
- Hardback
- Pages:
- 322
- Published:
- September 11, 2014
- Edition:
- 2015
- Dimensions:
- 155x235x21 mm.
- Weight:
- 6944 g.
Delivery:
2-3 weeks
Expected delivery: October 17, 2024
Description of Wafer-Level Chip-Scale Packaging
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
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