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3D IC Integration and Packaging
- Binding:
- Hardback
- Pages:
- 480
- Published:
- October 15, 2015
- Dimensions:
- 196x245x28 mm.
- Weight:
- 1028 g.
Delivery:
2-4 weeks
Expected delivery: August 17, 2025
Description of 3D IC Integration and Packaging
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
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