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3D Interconnect Architectures for Heterogeneous Technologies
- Binding:
- Hardback
- Pages:
- 424
- Published:
- June 28, 2022
- Edition:
- 22001
- Dimensions:
- 160x29x241 mm.
- Weight:
- 799 g.
Delivery:
2-4 weeks
Expected delivery: May 25, 2024
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- Art & Culture > Architecture & Design
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