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3D Microelectronic Packaging
- From Fundamentals to Applications
- Binding:
- Paperback
- Pages:
- 463
- Published:
- July 13, 2018
- Edition:
- 12017
- Dimensions:
- 155x235x0 mm.
- Weight:
- 724 g.
Delivery:
1-2 weeks
Expected delivery: October 17, 2024
Description of 3D Microelectronic Packaging
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
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