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Hybrid Assemblies and Multichip Modules
- Binding:
- Hardback
- Pages:
- 296
- Published:
- December 16, 1992
- Dimensions:
- 156x234x17 mm.
- Weight:
- 635 g.
Delivery:
2-3 weeks
Expected delivery: May 31, 2024
Description of Hybrid Assemblies and Multichip Modules
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
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