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More-than-Moore 2.5D and 3D SiP Integration
- Binding:
- Paperback
- Pages:
- 182
- Published:
- May 3, 2018
- Edition:
- 12017
- Dimensions:
- 155x235x0 mm.
- Weight:
- 454 g.
Delivery:
1-2 weeks
Expected delivery: December 5, 2024
Description of More-than-Moore 2.5D and 3D SiP Integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime.
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