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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
- Binding:
- Paperback
- Pages:
- 84
- Published:
- February 15, 2016
- Dimensions:
- 191x6x235 mm.
- Weight:
- 176 g.
Delivery:
1-2 weeks
Expected delivery: November 16, 2024
Description of New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
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