Join thousands of book lovers
Sign up to our newsletter and receive discounts and inspiration for your next reading experience.
By signing up, you agree to our Privacy Policy.You can, at any time, unsubscribe from our newsletters.
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
- Binding:
- Paperback
- Pages:
- 84
- Published:
- February 15, 2016
- Dimensions:
- 191x6x235 mm.
- Weight:
- 176 g.
Delivery:
1-2 weeks
Expected delivery: January 5, 2025
Extended return policy to January 30, 2025
Description of New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
User ratings of New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
Rate this book
In order to rate this book you must be logged in.Others also bought..
Find similar books
The book New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation can be found in the following categories:
- Business & Education > Computing & IT
- > >
- > >
- > >
- > > >
- >
You can, at any time, unsubscribe from our newsletters.
© 2024 Tales
All packages are shipped from our warehouse in the UK.
Company address: Esromgade 15, 3. - 2200 - DK
Registered company number: DK43351621
