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Semiconductor Product Engineering, Quality and Operations
- Binding:
- Paperback
- Pages:
- 132
- Published:
- December 5, 2023
- Edition:
- 23001
- Dimensions:
- 168x8x240 mm.
- Weight:
- 236 g.
Delivery:
2-4 weeks
Expected delivery: January 25, 2025
Extended return policy to January 30, 2025
Description of Semiconductor Product Engineering, Quality and Operations
This book captures the author¿s 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric ¿NPI hub¿ and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.
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