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Testing of Interposer-Based 2.5D Integrated Circuits

About Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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  • Language:
  • English
  • ISBN:
  • 9783319854618
  • Binding:
  • Paperback
  • Pages:
  • 182
  • Published:
  • May 8, 2018
  • Edition:
  • 12017
  • Dimensions:
  • 155x235x0 mm.
  • Weight:
  • 3051 g.
Delivery: 1-2 weeks
Expected delivery: December 7, 2024

Description of Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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