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Thermal Computations for Electronics

- Conductive, Radiative, and Convective Air Cooling

About Thermal Computations for Electronics

The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.

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  • Language:
  • English
  • ISBN:
  • 9780367465315
  • Binding:
  • Hardback
  • Pages:
  • 404
  • Published:
  • May 12, 2020
  • Edition:
  • 2
  • Dimensions:
  • 260x183x30 mm.
  • Weight:
  • 914 g.
Delivery: 2-3 weeks
Expected delivery: May 23, 2024

Description of Thermal Computations for Electronics

The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.

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