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Thermal Management of Microelectronic Equipment
- Heat Transfer Theory, Analysis Methods, and Design Practices
part of the Electronic Packaging series
- Binding:
- Hardback
- Pages:
- 500
- Published:
- July 30, 2016
- Edition:
- 2
- Dimensions:
- 152x229x29 mm.
Delivery:
2-4 weeks
Expected delivery: May 26, 2024
Description of Thermal Management of Microelectronic Equipment
This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
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