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Three-Dimensional Molded Interconnect Devices (3D-MID)
- Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
- Binding:
- Hardback
- Pages:
- 356
- Published:
- April 30, 2014
- Dimensions:
- 174x246x25 mm.
- Weight:
- 1001 g.
Delivery:
2-4 weeks
Expected delivery: August 1, 2024
Description of Three-Dimensional Molded Interconnect Devices (3D-MID)
Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
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