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Through-Silicon Vias for 3D Integration
- Binding:
- Hardback
- Pages:
- 512
- Published:
- December 15, 2012
- Dimensions:
- 160x231x21 mm.
- Weight:
- 722 g.
Delivery:
2-4 weeks
Expected delivery: August 17, 2025
Description of Through-Silicon Vias for 3D Integration
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
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